(21 May 2024, Kuala Lumpur) Taiwan is a global leader in the semiconductor industry and is optimistic about the continuous growth of Malaysia's packaging and testing supply chain cluster. The International Trade Administration, Ministry of Economic Affairs, in collaboration with the Precision Machinery Research & Development Center (PMC) and TAITRA, will lead 7 prominent Taiwanese companies to establish a Taiwan Pavilion at SEMICON SEA (May 28-May 30). Additionally, two product launch events will be held on May 28 and 29 to strengthen the cooperative model between the semiconductor supply chains of Taiwan and Malaysia.
Taiwan's achievements in the global semiconductor industry are obvious to all, including first in the world in wafer foundry output value, first in the world in packaging and testing, second in the world in IC design, and fourth in the world in DRAM. Therefore, the world's top five semiconductor equipment manufacturers (Applied Materials, ASML, TEL, Lam Research, and KLA) have all set up assembly plants or R&D and service bases in Taiwan in recent years. Promote the development of local equipment, modules, components and materials in Taiwan and establish a very complete semiconductor supply chain system in Taiwan.
Malaysia currently accounts for 13% of the global market for semiconductor packaging and testing. In recent years, it has included international semiconductor Foundry, OSAT and IDM such as Intel, ASE, GlobalFoundries, and Infineon are all expanding investment in Malaysia and will definitely need a complete supply chain to support them in the future. Taiwan and Malaysia are very complementary in this regard.
In this regard, the Taiwan Pavilion will host innovation technology and product launch events on the first and second days of the exhibition. 7 Taiwanese semiconductor packaging, testing and automation equipment manufacturers will be invited to present their latest technologies and solutions. There are GPM’s Planarization solutions for advanced packaging process, Delta Electronics’ semiconductor equipment information integration solution, Contrel Technology’s smart factory solution applied in semiconductor packaging and testing factories, TRI’s 3D optics and AI for packaging and testing technology, Shuz Tung’s Intelligent Packing and Logistics：An Integrated One-Stop Solution for Foundry and OSAT, fusionSiP's semiconductor IC design solutions, and Bossmen’s design for nanoscale photomask preservation and smart energy-saving control etc. The aim is to share the experience of Taiwan's semiconductor industry supply chain with Malaysian companies, seeking opportunities for technical cooperation, agency partnerships, and contract manufacturing.
SEMICON Southeast Asia will be held at the Malaysia International Trade and Exhibition Centre (MITEC). The Taiwan Pavilion is located on the second floor in Hall 7, booth number 3919. Registration for the product launch events can be done at: https://twmt.tw/semiconsea2024/
This article is provided by the Taiwan Electronic Equipment Industry Association (TEEIA).
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